Surfect Technologies Announces First Concentrator Module Shipment and Higher Solar Efficiency Results
Tempe, Az., Feb. 4, 2009
Source: Surfect Technologies, Inc, press release
http://surfect.ir.stockpr.com/news/detail/101/
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Surfect Technologies, Inc, a provider of advanced interconnect and packaging solutions for solar cells, LED and power management applications, today announced a number of key milestones for the company including:
– successful demonstrations for leading solar manufacturers of copper plating over silver paste on solar cells using Surfect’s proprietary tool and process technology, which resulted in 0.5-0.6% higher efficiency or 4-5% increased energy capture from solar cells;
– demonstration of new metallization process for solar manufacturers that allows copper metal deposition directly on bare silicon using DEP technology, which is expected to result in 1.2% to 2.0% higher efficiency or 5% to 10% increased energy capture(1) versus silver paste, at lower cost than competing metal plating systems;
– design and shipment of the first concentrator package for a European customer that uses rugged packaging technology and Surfect’s advanced wafer-level interconnect solutions producing 3x concentration, providing a more building integrated module and lowering the solar cost per watt.
Surfect’s multi-chemistry deposition tool uses advanced plating features, such as ultrasonic energy (DEPTM – Directed Energy Plating), to deposit copper plating on solar cells at higher throughput rates and improved adhesion levels than typical plating systems. Originally, developed for the semiconductor wafer bumping market, this technology enables more efficient and enhanced metal deposition processes–critical for lowering solar costs. Coupled with the vertical closed cell chambers and automated operation, this technology is targeted for more rapid conversion from silver paste to much more conductive copper metallization.
To date, solar manufacturers have used silver paste metallization, in order to capture and transport photons from the solar cell, which is less efficient than copper. Industry leaders such as SunPower Corporation are utilizing more conductive metallization to achieve higher efficiency rates. However, competing copper metal plating technologies require high upfront capital expenditures, highly trained personnel to operate, as well as highly technical process control expertise, which have prevented greater uptake by solar manufacturers.
Surfect has successfully demonstrated a 0.6% increase in solar cell efficiency by plating copper over the silver paste on several wafers provided by leading solar manufacturers, as well as standard wafers from several suppliers. The efficiency gain of 0.5-0.6% translates to a gain of 4-5% increased energy capture from the solar cell. This increased energy capture is expected to result in improved economics for the solar manufacturer.
Surfect also announced it has successfully demonstrated its new metallization process that allows copper metal deposition directly onto bare silicon using its unique tool technology. Preliminary testing done with this new process shows enhancements for the solar cell efficiency of 1.2% to 2.0%, which is expected to translate to increased energy capture of 5-10%. The company is working to establish third party validation.
This direct plating process has been designed to produce a number of denser metal patterns with finer lines that enhance the capture area on top of the cell. With the move to copper stack plating, which increases both the emitter contact conductivity and well as the bulk conductivity of the cell metallization, solar manufacturers can obtain greater energy absorption from the sun, increasing the efficiency and power, reducing the costs of the solar cells and enabling a faster move to grid parity.
The company also announced that it successfully designed and shipped its first concentrator module order. This initial design focused on producing a more building integrated, lower cost, yet high volume scalable solar concentrator module, for a European customer. The solar concentrator module utilizes Surfect’s advanced wafer level packaging interconnect technology, producing 3 times the measured energy output with one-third the silicon of a standard solar cell in a compact rugged module. The use of Surfect’s bumping technology coupled with semiconductor interconnect technology enables lower contact resistance connection paths by replacing silver tape with metal interconnects and multiple bus bars all in a low cost module that can be built on semiconductor packaging lines. The company sees a large opportunity to combine both advanced metal on the solar cell, as well as improved interconnects, to create a wider range of differentiated modules. Surfect’s highly efficient metal interconnects can reduce solar cost by eliminating the labor and time intensive interconnect process with typical modules.
Mr. Steve Anderson, chief executive officer of Surfect, commented, “It is clear to us that the solar industry needs better packaging technology and we are extremely well positioned to provide unique and timely solutions. Surfect is approaching the challenges of the solar industry on the manufacturing side, with the goal of providing manufacturers with equipment and solutions for higher energy capture and greater process speeds and yields. This initial order from a European customer, shipped during the fourth quarter of 2008, marks a major milestone for the company and the first step in our all encompassing solar interconnect strategy.”
“The first phase of our strategy is to provide current solar manufacturers with an immediate solution to improve energy capture from existing manufacturing processes that utilize silver paste to capture and transport photons from the solar cell. We are encouraged by the successful deposition of copper on the current silver paste with good adhesion results and increased energy capture, demonstrating the effectiveness of our proprietary, computer-driven Direct Energy Plating(TM) (DEP) technology.”
“Within the second phase of our strategy, we are now compiling additional data that reinforces the efficiencies to be gained from bare metal plating on solar cells, compared to traditional silver paste, using our low-cost tool solution. Unlike conventional metal plating solutions, Surfect’s DEP technology offers an affordable and scalable solution that directly addresses capital constraints within the solar industry.”
“For the final phase of our strategy, we look forward to introducing additional solar packaging solutions that will significantly enhance module integration and increase performance at the solar panel level. Using Surfect’s state-of-the art DEP technology and our knowledge of semiconductor bumping, we are able to interconnect more parts of a solar cell for improved performance. The combined impact of our technology and packaging expertise allow us to both improve the solar cell metallization, and hence cell efficiency, as well as offer our low resistance interconnect technology. We believe these combined technologies open new avenues for solar manufacturers to integrate solar cells, modules and panels, in ways that will dramatically reduce costs and improve margins by consolidating the solar supply chain.”
Mr. Anderson concluded, “Surfect can play an important role in helping solar manufacturers achieve parity with conventional sources of electricity by increasing the energy efficiency and reducing the production costs of solar cells. This dynamic will enable the solar industry to accelerate its evolution in such a way as to stand on its own in a non-subsidized market in the not-too-distant future. At the same time, President Obama has stated his interest in sparking a clean energy economy in the U.S. by doubling the production of alternative energy over the next three years. These factors combined, bode well for the future of solar power.”
About Surfect Technologies
Surfect develops and manufactures advanced interconnect solutions that are designed to support the growing demand for solar cell production by reducing the cost per delivered watt. The company’s proprietary Direct Energy Plating(TM) (DEP) is an innovative multi-wafer capable, single-cell electroplating process that uses ultrasonic energy to create the metal interconnect on the silicon wafers. The computer-driven DEP process is a “plug-and-play” plating and integrated packaging solution that provides customers with benefits such as a lower cost of ownership, improved process speeds and yields, environmentally sensitive processes, increased operational flexibility and a smaller operational footprint. Additional information about the company is available at www.surfect.com.
The statements in this press release relating to the increased efficiency that may come through the use of our technology, the value our solar technology can bring to solar manufacturers and our strategies are forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Additionally, words such as “expects,” “anticipates,” “intends,” “believes,” “will” and similar words are used to identify forward-looking statements.
The results anticipated by any or all of these forward-looking statements might not occur. Such uncertainties and risks include acquiring the necessary capital to commercialize products, global economic conditions, the price of oil and gas and the relative cost of solar power, acceptance of solar power, the functioning of our solar tools on a real-time basis, the availability of government tax breaks for solar power and potential contractual issues that may arise. We undertake no obligation to publicly update or revise any forward-looking statements, whether as the result of new information, future events or otherwise. For more information regarding some of the ongoing risks and uncertainties of our business, see the Risk Factors and our other filings with the Securities and Exchange Commission.